cystech electronics corp. spec. no. : c314m3 issued date : 2007.04.23 revised date : 2013.08.07 page no. : 1/6 bcx56m3 cystek product specification general purpose pnp epitaxial planar transistor BCX69M3 features ? large continuous collector current capability ? low collector saturation voltage ? complementary to bcx68m3 ? pb-free package symbol outline absolute maximum ratings (ta=25 c) parameter symbol limits unit collector-base voltage v cbo -40 v collector-emitter voltage v ceo -30 v emitter-base voltage v ebo -5 v collector current(dc) i c -1 a collector current(pulse) i cp -2 a 0.6 w 1 (note 1) w power dissipation pd 2 (note 2) w junction temperature tj 150 c storage temperature tstg -55~+150 c note : 1. when mounted on fr-4 pcb with area measuring 10101 mm 2 . when mounted on ceramic w ith area measuring 40401 mm sot-89 BCX69M3 b base c collector e emitter b c e
cystech electronics corp. spec. no. : c314m3 issued date : 2007.04.23 revised date : 2013.08.07 page no. : 2/6 bcx56m3 cystek product specification characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv cbo -40 - - v i c =-100 a bv ceo -30 - - v i c =-10ma bv ebo -5 - - v i e =-100 a i cbo - - -100 na v cb =-30v i ebo - - -100 na v eb =-5v *v ce(sat) - - -0.25 v i c =-500ma, i b =-50ma *v ce(sat) - - -0.5 v i c =-1a, i b =-100ma *v ce(sat) - - -1.0 v i c =-2a, i b =-200ma *v be(on) - - -1.0 v v ce =-1v, i c =-1a *h fe 1 100 - - - v ce =-1v, i c =-5ma *h fe 2 100 - 400 - v ce =-1v, i c =-500ma *h fe 3 60 - - - v ce =-1v, i c =-1a f t 100 - - mhz v ce =-5v, i c =-100ma, f=100mhz cob - - 25 pf v cb =-10v, i e =0a,f=1mhz *pulse test: pulse width 380 s, duty cycle 2% classification of h fe 2 rank 16 25 range 100~250 160~400 ordering information device package shipping marking BCX69M3 sot-89 (pb-free) 1000 pcs / tape & reel ah
cystech electronics corp. spec. no. : c314m3 issued date : 2007.04.23 revised date : 2013.08.07 page no. : 3/6 bcx56m3 cystek product specification characteristic curves current gain vs collector current 10 100 1000 1 10 100 1000 10000 collector current ---ic(ma) current gain---hfe hfe vce=5v vce=2v vce=1v saturation voltage vs collector current 10 100 1000 10000 1 10 100 1000 10000 collector current ---ic(ma) saturation voltage-(mv) vcesat ic=10ib ic=20ib saturation voltage vs collector current 100 1000 10000 1 10 100 1000 10000 collector current--- ic(ma) saturation voltage-(mv) vbesat@ic=10ib on voltage vs collector current 100 1000 10000 1 10 100 1000 10000 collector current--- ic(ma) on voltage-(mv) vbeon@vce=2v power derating curves 0 0.5 1 1.5 2 2.5 0 25 50 75 100 125 150 175 200 ambient temperature---ta() power dissipation---pd(w) see note 2 on page 1 see note 1 on p a g e 1
cystech electronics corp. spec. no. : c314m3 issued date : 2007.04.23 revised date : 2013.08.07 page no. : 4/6 bcx56m3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c314m3 issued date : 2007.04.23 revised date : 2013.08.07 page no. : 5/6 bcx56m3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 5 +1/-1 seconds 260 +0/-5 c recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c314m3 issued date : 2007.04.23 revised date : 2013.08.07 page no. : 6/6 bcx56m3 cystek product specification sot-89 dimension inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1732 0.1811 4.40 4.60 f 0.0591 typ 1.50 typ b 0.1551 0.1673 3.94 4.25 g 0.1181 typ 3.00 typ c 0.0610 ref 1.55 ref h 0.0551 0.0630 1.40 1.60 d 0.0906 0.1024 2.30 2.60 marking: ah e f g c b a i d h 3 2 1 3-lead sot-89 plastic surface mounted package cystek package code: m3 style: pin 1. base 2. collector 3. emitter device code hfe rank date code i 0.0138 0.0173 0.35 0.44 e 0.0126 0.0205 0.32 0.52 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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